APL5331 |
RFQ for APL5331 Required Field |
 |
| Product | Manufacturers | Pack | D/C |
| APL5331 | - | SOP-8 | 04+ |
On-chip thermal shutdown provides protection against any combination of overload that would create ex-cessive junction temperature. The output voltage of APL5331 track the voltage at VREF pin. A resistor divider connected to VIN, GND and VREF pins is used to provide a half voltage of VIN to VREF pin. In addition, an external ceramic capacitor and an open-drain transistor connected to VREF pin provides soft-start and shutdown control respectively. Pulling and holding the VREF to GND shuts off the output. The output of APL5331 will be high impedance after be-ing shut down by VREF or thermal shutdown function.
Typical Application |
Features |
| * DDR I/II SDRAM Termination* SSTL-2/3 Termination Voltage* Applications Requiring the Regulator withBi-direction 3A Current Capability | Provide Bi-direction Current - Sourcing or Sinking Current up to 3A 1.25V/0.9V Output for DDR I/II Applications Fast Transient Response High Output Accuracy - ±20mV over Load, VOUT Offset andTemperature Adjustable Output Voltage by External Resistors Current-Limit Protection On-Chip Thermal Shutdown Shutdown for Standby or Suspend Mode Simple SOP-8, SOP-8-P with thermal pad, TO-252- 5 and TO-263-5 Packages |
|
Symbol |
Parameter |
Rating |
Unit |
|
VCNTL |
VCNTL Supply Voltage, VCNTL to GND |
-0.2 ~ 7 |
V |
|
VIN |
VIN Supply Voltage, VIN to GND |
-0.2 ~ 3.9 |
V |
|
PD |
Power Dissipation |
Internally Limited |
W |
|
TJ |
Junction Temperature |
150 |
|
|
TSTG |
Storage Temperature |
-65 ~ 150 |
|
|
TSDR |
Soldering Temperature, 10 Seconds |
300 |
|
|
VESD |
Minimum ESD Rating (Human Body Mode) |
±3 |
kV |
